US 12,077,969 B2
Floor lift layer providing rigidity, sound reduction, and thermal insulation
Alan B. Collison, Pierce, NE (US); and Carl Fuelberth, Norfolk, NE (US)
Assigned to MP Global Products, L.L.C., Norfolk, NE (US)
Filed by MP Global Products, L.L.C., Norfolk, NE (US)
Filed on Jan. 24, 2023, as Appl. No. 18/100,838.
Claims priority of provisional application 63/304,421, filed on Jan. 28, 2022.
Prior Publication US 2023/0243162 A1, Aug. 3, 2023
Int. Cl. E04F 15/22 (2006.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); B32B 27/12 (2006.01); E04F 15/20 (2006.01)
CPC E04F 15/203 (2013.01) [B32B 5/02 (2013.01); B32B 7/12 (2013.01); B32B 27/12 (2013.01); B32B 2262/0276 (2013.01); B32B 2307/102 (2013.01); B32B 2307/304 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/718 (2013.01); B32B 2307/72 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/732 (2013.01); B32B 2471/00 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A floor structure comprising:
a subfloor;
a floor covering disposed above the subfloor; and
a floor lift layer disposed between the subfloor and the floor covering, the floor lift layer having at least one of (i) a top surface exposed to the floor covering and (ii) a bottom surface exposed to the subfloor, wherein the floor lift layer is a fiber structure that consists of a substrate fiber and a thermoplastic binder fiber, the substrate fiber being bound together by the thermoplastic binder fiber, the thermoplastic binder fiber making up between 25 percent (%) and 35% by weight of the floor lift layer.