a plating tank that includes a membrane disposed in the plating tank, an anode chamber comparted in a lower side of the membrane in the plating tank, and an anode disposed in the anode chamber;

a substrate holder disposed above the anode chamber, the substrate holder being configured to hold a substrate as a cathode with a surface to be plated of the substrate facing the anode;

at least one supply port disposed in an outer peripheral portion of the anode chamber, the at least one supply port being configured to supply a plating solution to the anode chamber;

at least one discharge port disposed in the outer peripheral portion of the anode chamber so as to face the at least one supply port, the at least one discharge port being configured to suction the plating solution in the anode chamber and discharge the plating solution from the anode chamber, a holding member provided at the outer peripheral portion of the anode chamber, and configured to hold an outer peripheral portion of the membrane; and

a guide member, the guide member comprising a plurality of guide plates, disposed on the lower surface of the membrane, and being configured to guide a flow of the shear flow flowing along the lower surface of the membrane; wherein

the at least one supply port and the at least one discharge port are configured such that the at least one discharge port suctions the plating solution supplied from the at least one supply port to form a shear flow of the plating solution along a lower surface on the lower surface of the membrane in the anode chamber; and

the plurality of guide plates have first ends provided on one directional side in a direction of extension of the plurality of guide plates and second ends provided on the other directional side in the direction of extension of the plurality of guide plates, and the first ends and the second ends are held by the holding member.