US 12,077,861 B2
Dithering or dynamic offsets for improved uniformity
Joseph AuBuchon, San Jose, CA (US); Sanjeev Baluja, Campbell, CA (US); Michael Rice, Pleasanton, CA (US); Arkaprava Dan, San Jose, CA (US); and Hanhong Chen, Milpitas, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Sep. 18, 2020, as Appl. No. 17/025,025.
Claims priority of provisional application 62/902,891, filed on Sep. 19, 2019.
Prior Publication US 2021/0087681 A1, Mar. 25, 2021
Int. Cl. C23C 16/458 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01)
CPC C23C 16/4584 (2013.01) [C23C 16/45544 (2013.01); C23C 16/52 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A processing method comprising:
moving a support surface from a first process position within a first processing station where a first cycle of a deposition process occurred to a first process position within a second processing station; and
moving the support surface from the first process position in the second processing station to a second process position within the first processing station, the second process position within the first processing station having a dynamic offset from the first process position within the first processing station;
and performing a second cycle of the deposition process in the first processing station with the support surface in the second process position, wherein the dynamic offset improves deposition uniformity of the deposition process.