arranging a first display substrate and a second display substrate in a chamber;

arranging a mask assembly to correspond to each of the first display substrate and the second display substrate;

aligning the mask assembly corresponding to one of the first display substrate and the second display substrate with one of the first display substrate and the second display substrate; and

supplying at least two deposition materials to the mask assembly through a deposition source comprising a plurality of crucibles within the chamber, and allowing the at least two deposition materials having passed through the mask assembly to be deposited on one of the first display substrate and the second display substrate, there being a separate angle limiting plate for each of the plurality of crucibles, wherein the angle limiting plate has different portions disposed on different parts of each of the crucibles and adjusts an ejection angle of the deposition material ejected from the crucible,

wherein an amount of the at least two deposition materials is adjusted by controlling an amount of a deposition material ejected from each of the plurality of crucibles through a shutter portion or by controlling an amount of a deposition material supplied to each of the plurality of crucibles through a cut-off portion, and

wherein the controlling an amount of a deposition material ejected from each of the plurality of crucibles through a shutter portion comprises:

calculating an evaporation rate of the deposition material by measuring an internal pressure and an internal temperature of each of the plurality of crucibles with a sensor portion provided directly on each of the plurality of crucibles, the deposition material being in direct contact with the plurality of crucibles;

comparing the evaporation rate to a preset evaporation rate; and

adjusting a degree of opening of the shutter portion based on the comparing.