CPC C23C 14/08 (2013.01) [B32B 7/12 (2013.01); B32B 17/06 (2013.01); C23C 14/28 (2013.01); C23C 14/3407 (2013.01); B32B 2255/20 (2013.01); B32B 2255/26 (2013.01); B32B 2307/412 (2013.01); B32B 2457/00 (2013.01); H05K 5/03 (2013.01)] | 13 Claims |
1. A cover member of an electronic device, comprising:
a substrate film layer;
a metal-oxide layer disposed on an upper surface of the substrate film layer and formed by sputtering;
a transparent member bonded to an upper surface of the metal-oxide layer;
a primer layer disposed on a lower surface of the substrate film layer and made of a translucent material;
a photocurable resin layer disposed on a lower surface of the primer layer and comprising a pattern structure including a designated three-dimensional shape on a surface thereof;
a deposition layer disposed on a lower surface of the photocurable resin layer, and comprising one surface facing the photocurable resin layer including a recess having a shape corresponding to the shape of the pattern structure and an opposite surface formed to be flat, wherein the deposition layer comprises at least one layer formed through electron beam (E-beam) evaporation or sputtering; and
a printing layer disposed on a lower surface of the deposition layer and configured to block a path of light emitted out of or into the electronic device.
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