	US 12,077,706 B2
	Hybrid silicone composite for high temperature applications
Dejie Tao, Fremont, CA (US); Yiliang Wu, San Ramon, CA (US); Lananh Pham, Fremont, CA (US); Lei Wang, San Jose, CA (US); Ting Gao, Palo Alto, CA (US); Andre Martin Dressel, Lampertheim (DE); and Frank Schabert, Nuremberg (DE)
Assigned to TE CONNECTIVITY SERVICES GMBH, Schaffhausen (CH); and TE CONNECTIVITY GERMANY GMBH, Bensheim (DE)
Filed by TE Connectivity Services GmbH, Schaffhausen (CH); and TE Connectivity Germany GmbH, Bensheim (DE)
Filed on Jan. 28, 2021, as Appl. No. 17/161,128.
Prior Publication US 2022/0235271 A1, Jul. 28, 2022
Int. Cl. C09K 21/14 (2006.01); C08G 77/04 (2006.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); C09K 21/02 (2006.01); H01M 50/128 (2021.01); H01M 50/129 (2021.01); H01M 50/143 (2021.01)

CPC C09K 21/14 (2013.01) [C08G 77/04 (2013.01); C08K 3/22 (2013.01); C08K 3/26 (2013.01); C09K 21/02 (2013.01); H01M 50/128 (2021.01); H01M 50/129 (2021.01); H01M 50/143 (2021.01); C08K 2003/2206 (2013.01); C08K 2003/2224 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/262 (2013.01); C08K 2003/267 (2013.01)]

11 Claims

1. A silicone composite comprising: a silicone mixture and a thermally decomposable inorganic filler which can be decomposed at a temperature of 500° C. and below, wherein said inorganic filler is from about 10 weight % to about 90 weight % of said silicone composite, wherein said silicone composite when exposed to a high temperature forms at least a portion of an inorganic composite and maintains its dimensional stability wherein said silicone composite has a viscosity from about 10000 to about 1000000 Pa·S at a shear rate of 1.0 rads/s at 25 degrees C., and a density of about 1.3 to about 1.8 g/cm³and wherein said silicone mixture comprises a liquid high consistency silicone rubber and a solid high consistency silicone rubber, said solid high consistency rubber is a solid at 25-250° C., has a Mooney viscosity of about 10 to about 200 and with a hardness from Shore A 10 to Shore A 90.