US 12,077,687 B2
Hot-melt adhesive and method for producing bonded article
Kentaro Yamawaki, Shizuoka (JP); Yuhei Terui, Shizuoka (JP); and Tsutomu Shimano, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Feb. 25, 2022, as Appl. No. 17/680,570.
Claims priority of application No. 2021-035177 (JP), filed on Mar. 5, 2021.
Prior Publication US 2022/0282124 A1, Sep. 8, 2022
Int. Cl. C09J 5/06 (2006.01); B32B 37/12 (2006.01); C09J 11/08 (2006.01); C09J 125/14 (2006.01)
CPC C09J 5/06 (2013.01) [B32B 37/1207 (2013.01); C09J 11/08 (2013.01); C09J 125/14 (2013.01); B32B 2037/1215 (2013.01); C09J 2425/00 (2013.01); C09J 2467/00 (2013.01); C09J 2491/00 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A hot-melt adhesive, comprising:
a thermoplastic resin; and
a first crystalline material, wherein
Tc is 20 to 60° C., Tm is 50 to 110° C. and Tm−Tc is 20.0 to 70.0° C.
when in differential scanning calorimetric measurement of the hot-melt adhesive, Tc (° C.) is a peak temperature of the highest peak of exothermic peaks observed in a temperature reduction process at 10° C./min following heating to 150° C. and Tm (° C.) is a peak temperature of the highest peak of endothermic peaks observed in a temperature increasing process at 10° C./min following the temperature reduction process, and
a tetrahydrofuran-soluble matter of the hot-melt adhesive has a weight-average molecular weight Mw of 100,000 to 400,000 as measured by gel permeation chromatography.