CPC C09J 5/06 (2013.01) [B32B 37/1207 (2013.01); C09J 11/08 (2013.01); C09J 125/14 (2013.01); B32B 2037/1215 (2013.01); C09J 2425/00 (2013.01); C09J 2467/00 (2013.01); C09J 2491/00 (2013.01)] | 8 Claims |
1. A hot-melt adhesive, comprising:
a thermoplastic resin; and
a first crystalline material, wherein
Tc is 20 to 60° C., Tm is 50 to 110° C. and Tm−Tc is 20.0 to 70.0° C.
when in differential scanning calorimetric measurement of the hot-melt adhesive, Tc (° C.) is a peak temperature of the highest peak of exothermic peaks observed in a temperature reduction process at 10° C./min following heating to 150° C. and Tm (° C.) is a peak temperature of the highest peak of endothermic peaks observed in a temperature increasing process at 10° C./min following the temperature reduction process, and
a tetrahydrofuran-soluble matter of the hot-melt adhesive has a weight-average molecular weight Mw of 100,000 to 400,000 as measured by gel permeation chromatography.
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