US 12,077,684 B2
Temporary adhesive, temporary adhesive assembly, and method of processing substrate
Yaosen Wang, Shanghai (CN); Xiaoyi Gao, Shanghai (CN); and Dongchen Ji, Shanghai (CN)
Assigned to PhiChem Corporation, Shanghai (CN)
Filed by PhiChem Corporation, Shanghai (CN)
Filed on Sep. 29, 2021, as Appl. No. 17/449,410.
Claims priority of application No. 202011057611.1 (CN), filed on Sep. 29, 2020.
Prior Publication US 2022/0098456 A1, Mar. 31, 2022
Int. Cl. C09J 171/00 (2006.01); C09J 5/00 (2006.01); C09J 163/00 (2006.01); C09J 169/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01)
CPC C09J 171/00 (2013.01) [C09J 5/00 (2013.01); C09J 163/00 (2013.01); C09J 169/00 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A temporary adhesive, comprising: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %,
wherein the polar resin comprises at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group;
the first solvent is used to dissolve the polar resin; and
the second solvent is used to improve a leveling property of the temporary adhesive.