US 12,077,666 B2
Resin composition, cured product, molding and method for producing same, and film capacitor and method for producing same
Yasunori Kawabata, Tokyo (JP); Kasumi Nakamura, Tokyo (JP); Tatsuhito Fukuhara, Tokyo (JP); and Takahide Iwaya, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 16/759,630
Filed by HITACHI CHEMICAL COMPANY, LTD., Tokyo (JP)
PCT Filed Sep. 28, 2018, PCT No. PCT/JP2018/036479
§ 371(c)(1), (2) Date Jul. 16, 2020,
PCT Pub. No. WO2019/087641, PCT Pub. Date May 9, 2019.
Claims priority of application No. PCT/JP2017/039161 (WO), filed on Oct. 30, 2017.
Prior Publication US 2020/0347222 A1, Nov. 5, 2020
Int. Cl. C08L 63/00 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 5/3492 (2006.01); C08K 7/22 (2006.01); H01G 4/224 (2006.01); C08L 63/10 (2006.01)
CPC C08L 63/00 (2013.01) [H01G 4/224 (2013.01); C08K 3/042 (2017.05); C08K 2003/2227 (2013.01); C08K 3/36 (2013.01); C08K 5/34922 (2013.01); C08K 7/22 (2013.01); C08K 2201/005 (2013.01); C08L 63/10 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A resin composition for casting, comprising:
a curable component comprising a curable resin and a curing agent, wherein the curing agent includes an acid anhydride;
expandable graphite, wherein a major axis of the expandable graphite is 800 μm or less; and
a filler containing silica,
wherein a viscosity in a case in which the viscosity is measured using a B type viscometer under conditions of 40° C. and 60 rpm is 8.0 Pa·s or less,
wherein a content of silica is 30% by mass or more based on a total mass of the resin composition excluding the mass of solvent, and
wherein a content of the curing agent is 15% to 55% by mass based on the total mass of the resin composition excluding the mass of solvent.