US 12,077,643 B2
Non-polar ethylene-based compositions with triallyl phosphate for encapsulant films
Chao He, Shanghai (CN); Bharat I. Chaudhary, Collegeville, PA (US); Brian M. Habersberger, Lake Jackson, TX (US); Hong Yang, Shanghai (CN); Weiming Ma, Shanghai (CN); and Yuyan Li, Beijing (CN)
Assigned to Dow Global Technologies LLC, Midland, MI (US)
Filed by Dow Global Technologies LLC, Midland, MI (US)
Filed on Oct. 3, 2022, as Appl. No. 17/958,911.
Application 17/958,911 is a continuation of application No. 16/617,978, abandoned, previously published as PCT/CN2017/086553, filed on May 31, 2017.
Prior Publication US 2023/0047706 A1, Feb. 16, 2023
Int. Cl. C08J 5/18 (2006.01); C08F 210/16 (2006.01); C08K 5/14 (2006.01); C08K 5/3492 (2006.01); C08K 5/521 (2006.01); C08K 5/5425 (2006.01); H01L 31/048 (2014.01)
CPC C08J 5/18 (2013.01) [C08F 210/16 (2013.01); C08K 5/14 (2013.01); C08K 5/34924 (2013.01); C08K 5/521 (2013.01); C08K 5/5425 (2013.01); H01L 31/0481 (2013.01); C08F 2810/20 (2013.01); C08J 2323/08 (2013.01); C08K 2201/014 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An electronic device module comprising:
an electronic device having a front surface and an opposing rear surface, and
a front encapsulant film and a rear encapsulant film, each encapsulant film consisting of a crosslinked polymeric composition which is the reaction product of a composition consisting of
(A) from 97.75 wt % to 98.25 wt % of a polymeric component consisting of one or more linear non-polar ethylene-based polymers, each linear non-polar ethylene-based polymer consisting of (i) ethylene and (ii) a linear C4-C8 α-olefin, each of the ethylene-based polymers having a density of 0.850 g/cc to 0.890 g/cc
(B) from 0.75 wt % to 1.5 wt % of an organic peroxide;
(C) from 0.1 wt % to 0.3 wt % of a silane coupling agent; and
(D) from 0.25 wt % to 1.0 wt % of a co-agent consisting of triallyl phosphate and optionally at least one of triallyl cyanurate and triallyl isocyanurate;
the electronic device is sandwiched between the front encapsulant film and the rear encapsulant film, the front encapsulant film is in direct contact with the front surface of the electronic device and the rear encapsulant film is in direct contact with the opposing rear surface of the electronic device and the electronic device is totally enclosed within the front encapsulant film and the rear encapsulant film, at least one film has a volume resistivity from greater than or equal to 2.2*1015 ohm.cm to 9.5*1015 ohm.cm at 60° C.;
a cover sheet in direct contact with the front encapsulant film and the front encapsulant film has an initial glass adhesion greater than 120 N/cm to 200 N/cm; and
a backsheet consisting of a material selected from the group consisting of glass, metal, fluorine polymer, polyethylene terephthalate, and combinations thereof, the rear encapsulant film sandwiched between, and in direct contact with, (i) the electronic device and (ii) with the backsheet.