US 12,077,629 B2
Isocyanate composition and binder system containing said isocyanate composition
Annika Klose, Hannover (DE); and Markus Schabrucker, Düsseldorf (DE)
Assigned to HÜTTENES-ALBERTUS Chemische Werke Gesellschaft mit beschränkter Haftung, Düsseldorf (DE)
Appl. No. 17/298,986
Filed by HÜTTENES-ALBERTUS Chemische Werke Gesellschaft mit beschränkter Haftung, Düsseldorf (DE)
PCT Filed Dec. 10, 2019, PCT No. PCT/EP2019/084470
§ 371(c)(1), (2) Date Jun. 2, 2021,
PCT Pub. No. WO2020/126689, PCT Pub. Date Jun. 25, 2020.
Claims priority of application No. 102018133239.4 (DE), filed on Dec. 20, 2018.
Prior Publication US 2022/0064362 A1, Mar. 3, 2022
Int. Cl. B22C 1/22 (2006.01); C08G 18/08 (2006.01); C08G 18/54 (2006.01); C08G 18/76 (2006.01); C08J 7/05 (2020.01)
CPC C08G 18/542 (2013.01) [B22C 1/2273 (2013.01); C08G 18/0842 (2013.01); C08G 18/7671 (2013.01); C08J 7/05 (2020.01); C08J 2375/04 (2013.01)] 13 Claims
 
1. An isocyanate composition comprising
a) one or more isocyanates having at least two isocyanate groups per molecule
b) one or more β-dicarbonyl compounds, wherein the one or more β-dicarbonyl compounds comprise a dialkyl ester of malonic acid
c) a solvent which is not an isocyanate, a β-dicarbonyl compound or an aldehyde,
where the concentration
a) of the isocyanates is 60% to 89%
b) of the β-dicarbonyl compounds is 1% to 38%,
based in each case on the total mass of the isocyanate composition.
 
5. A binder system comprising
(i) a phenolic resin component and
(ii) a separate polyisocyanate component,
wherein
(i) the phenolic resin component comprises:
e) one or more phenolic resins
f) a solvent,
wherein, based on the total mass of the phenolic resin component, the concentration of the phenolic resins e) is 40% to 60%,
and
(ii) the polyisocyanate component is an isocyanate composition as defined in claim 1.
 
8. A process comprising the steps of:
producing a molding material mixture by mixing the phenolic resin component (i) and the polyisocyanate component (ii) of a binder system as claimed in claim 5 with a molding material base, so as to form a molding material mixture comprising the phenolic resin component (i) and the polyisocyanate component (ii) of the binder system and a molding material base,
molding the molding material mixture,
curing the binder system in the molded molding material mixture to form a molding.