CPC B81B 7/02 (2013.01) [B81C 1/00341 (2013.01); G01C 19/5783 (2013.01); G01L 7/082 (2013.01); G01L 19/0092 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81C 2201/0105 (2013.01); B81C 2201/014 (2013.01)] | 15 Claims |
1. A micromechanical sensor device, comprising:
a substrate which has a front side and a rear side;
an inertial sensor region including an inertial structure configured to acquire external accelerations and/or rotations and a pressure sensor region having a diaphragm region configured to acquire an external pressure, formed on the front side, at a lateral distance;
a first micromechanical function layer applied on the front side;
a second micromechanical function layer applied on the first micromechanical function layer, by which the diaphragm region is formed in the pressure sensor region, which is set apart from the first micromechanical function layer;
a third micromechanical function layer applied on the second micromechanical function layer, the inertial structure being formed out of the second and/or third micromechanical function layer; and
a cap device which is bonded to the third micromechanical function layer and encloses in the inertial sensor region a first predefined reference pressure in a first cavity and which has a first through opening in the pressure sensor region for application of the external pressure to the diaphragm region;
wherein a second cavity formed underneath the diaphragm region in which a second, predefined reference pressure is enclosed.
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