US 12,077,392 B2
Substrate transfer apparatus and substrate transfer method
Hitoshi Hashima, Kumamoto (JP); Tohru Tochihara, Kumamoto (JP); Michiaki Matsushita, Kumamoto (JP); and Hidekazu Kiyama, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on May 10, 2021, as Appl. No. 17/315,423.
Claims priority of application No. 2020-083452 (JP), filed on May 11, 2020.
Prior Publication US 2021/0347584 A1, Nov. 11, 2021
Int. Cl. B65G 47/90 (2006.01); G03F 7/16 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H05K 9/00 (2006.01)
CPC B65G 47/90 (2013.01) [G03F 7/162 (2013.01); H01L 21/67766 (2013.01); H01L 21/6838 (2013.01); H01L 21/68707 (2013.01); H01L 21/6875 (2013.01); H05K 9/0067 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A substrate transfer apparatus comprising:
a non-conductive support having an upper surface that faces a substrate and is configured to support the substrate;
a mover configured to move the support and transfer the substrate;
a connector configured to connect the support and the mover while being grounded;
a conductive contact provided in a recess on the upper surface of the support, and configured to support the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; and
a strip-shaped conductive path configured to connect the contact and the connector, wherein the strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.