US 12,077,104 B2
Camera module
Hirofumi Owaki, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/799,244
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
PCT Filed Feb. 10, 2021, PCT No. PCT/JP2021/004981
§ 371(c)(1), (2) Date Aug. 11, 2022,
PCT Pub. No. WO2021/166764, PCT Pub. Date Aug. 26, 2021.
Claims priority of application No. 2020-026042 (JP), filed on Feb. 19, 2020.
Prior Publication US 2023/0080778 A1, Mar. 16, 2023
Int. Cl. B60R 11/04 (2006.01); G03B 17/02 (2021.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01)
CPC B60R 11/04 (2013.01) [G03B 17/02 (2013.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01)] 10 Claims
OG exemplary drawing
 
1. A camera module, comprising:
a housing that includes a first case that includes an opening, and a second case that is joined to the first case;
a barrel member that is arranged in the housing, and includes a barrel that is fitted into the opening in an optical-axis direction;
a sensor board that is arranged in the housing and includes an imaging device that faces the barrel member; and
a metallic shield case that is arranged between the barrel member and the second case, the shield case including a peripheral wall portion that covers around the sensor element, and an elastic part that is provided to an end of the peripheral wall portion and biases the barrel member toward the opening, the elastic part including a control portion that controls approach of the barrel member to the second case such that the barrel member is at a distance greater than or equal to a specified distance from the second case.