US 12,076,971 B2
Laminated glass structures for electronic devices and electronic device substrates
Jin Su Kim, Seoul (KR); and Dean Michael Thelen, Addison, NY (US)
Assigned to CORNING INCORPORATED, Corning, NY (US)
Appl. No. 17/041,884
Filed by CORNING INCORPORATED, Corning, NY (US)
PCT Filed Mar. 27, 2019, PCT No. PCT/US2019/024388
§ 371(c)(1), (2) Date Sep. 25, 2020,
PCT Pub. No. WO2019/191302, PCT Pub. Date Oct. 3, 2019.
Claims priority of provisional application 62/649,236, filed on Mar. 28, 2018.
Prior Publication US 2021/0129486 A1, May 6, 2021
Int. Cl. B32B 7/027 (2019.01); B32B 17/06 (2006.01); C03C 3/087 (2006.01); C03C 3/091 (2006.01); C03C 3/093 (2006.01); C03C 4/18 (2006.01); C03C 10/00 (2006.01); C03C 21/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01)
CPC B32B 7/027 (2019.01) [B32B 17/06 (2013.01); C03C 3/087 (2013.01); C03C 3/091 (2013.01); C03C 3/093 (2013.01); C03C 4/18 (2013.01); C03C 10/0009 (2013.01); C03C 10/0054 (2013.01); H05K 1/024 (2013.01); H05K 1/0306 (2013.01); B32B 2307/30 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01); C03C 21/002 (2013.01); C03C 2204/00 (2013.01); H05K 2201/017 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/068 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A laminated glass structure for an electronic device, comprising:
a core glass layer having a first coefficient of thermal expansion (CTE); and
a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer,
wherein a first of the clad layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer,
wherein the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm, and
further wherein each of the first of the clad layers and the core glass layer comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to 100 GHz.