US 12,076,968 B2
Sandwich panel molding method
Yukihiro Kamimura, Kanagawa (JP); and Tomohiro Ito, Kanagawa (JP)
Assigned to The Yokohama Rubber Co., LTD., Tokyo (JP)
Appl. No. 18/546,030
Filed by The Yokohama Rubber Co., LTD., Kanagawa (JP)
PCT Filed Oct. 11, 2021, PCT No. PCT/JP2021/037513
§ 371(c)(1), (2) Date Aug. 10, 2023,
PCT Pub. No. WO2022/176261, PCT Pub. Date Aug. 25, 2022.
Claims priority of application No. 2021-022230 (JP), filed on Feb. 16, 2021.
Prior Publication US 2024/0034045 A1, Feb. 1, 2024
Int. Cl. B32B 37/14 (2006.01); B32B 5/18 (2006.01); B32B 7/10 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); B32B 37/06 (2006.01)
CPC B32B 37/144 (2013.01) [B32B 5/18 (2013.01); B32B 7/10 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/286 (2013.01); B32B 27/38 (2013.01); B32B 37/06 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2266/0214 (2013.01); B32B 2307/30 (2013.01); B32B 2307/72 (2013.01); B32B 2307/736 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of molding a sandwich panel, the method comprising
a step of providing, on one or both surfaces of an (a) core material, a prepreg as a (b) skin material,
the (a) core material being a super engineering plastic foam having a glass transition temperature of greater than 200° ° C., and
the (b) skin material containing:
a (b-1) epoxy resin having an average molecular weight of 1300 or more or having a trishydroxymethane-type or cresol novolac-type structure and containing, in a total epoxy resin, an amount of 70 to 100 mass % of an epoxy resin that is semi-solid or solid at room temperature (23° C.);
a (b-2) epoxy resin containing, in the total epoxy resin, an amount of 0 to 30 mass % of an epoxy resin that is liquid at room temperature (23° C.); and
a (b-3) curing agent; wherein
the prepreg as the (b) skin material is a self-adhesive material which is directly bonded to the (a) core material without an adhesive and which is cured.