US 12,076,948 B2
Composite material structure and composite material structure producing method
Terukazu Kosako, Susono (JP)
Assigned to YAZAKI CORPORATION, Tokyo (JP)
Filed by Yazaki Corporation, Tokyo (JP)
Filed on Jun. 21, 2021, as Appl. No. 17/352,510.
Claims priority of application No. 2020-116363 (JP), filed on Jul. 6, 2020.
Prior Publication US 2022/0001633 A1, Jan. 6, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B29C 70/88 (2006.01); C08J 5/04 (2006.01); H01B 1/24 (2006.01); H01B 3/00 (2006.01); H01B 3/47 (2006.01)
CPC B29C 70/882 (2013.01) [C08J 5/042 (2013.01); H01B 1/24 (2013.01); H01B 3/004 (2013.01); H01B 3/47 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A composite material structure comprising:
a conductive resin portion formed of an electrically conductive reinforced resin in which conductive fibers are contained in an insulating base material;
a conductor which is formed of an electrically conductive material and at least a part of which is embedded in the conductive resin portion; and
a plurality of layers of insulating resin portions which is layers of resin portions each including insulating fibers contained in an insulating base material, the plurality of layers of the insulating resin portions being embedded in the conductive resin portion so as to sandwich therebetween the at least the part of the conductor and so as to be interposed between the conductive fibers and the conductor, and
wherein at least some of the plurality of layers of insulating resin portions are protruded from the conductive resin portion.