US 12,076,932 B2
Systems and methods for tool-less manufacturing of thermoplastic parts
Adam Jason Jones, Lucerne Valley, CA (US); Paul Edward Sherman, Wrightwood, CA (US); and John Angely Geriguis, Wrightwood, CA (US)
Assigned to General Atomics Aeronautical Systems, Inc., San Diego, CA (US)
Filed by General Atomics Aeronautical Systems, Inc., San Diego, CA (US)
Filed on Jun. 7, 2023, as Appl. No. 18/206,965.
Application 17/212,711 is a division of application No. 15/905,776, filed on Feb. 26, 2018, granted, now 10,987,871, issued on Apr. 27, 2021.
Application 18/206,965 is a continuation of application No. 17/212,711, filed on Mar. 25, 2021, granted, now 11,691,345.
Claims priority of provisional application 62/468,899, filed on Mar. 8, 2017.
Prior Publication US 2023/0311422 A1, Oct. 5, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B29C 64/393 (2017.01); B29C 64/106 (2017.01); B29C 64/118 (2017.01); B29C 64/209 (2017.01); B29C 64/40 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01)
CPC B29C 64/393 (2017.08) [B29C 64/106 (2017.08); B29C 64/118 (2017.08); B29C 64/209 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing thermoplastic objects, comprising:
dispensing thermoplastic material, from a dispensing device, in three dimensions according to a three-dimensional computer model having a three-dimensional computer model profile, wherein the dispensed thermoplastic material is supported by at least one support point of a support apparatus;
optically scanning the thermoplastic material during dispensing;
determining if the dispensed thermoplastic material requires adjustment in order to match the computer model profile within pre-determined engineering tolerances; and
adjusting, upon determining that the dispensed material requires adjustment, of at least one of a location of the dispensed material and a coordinate location of the support point, whereby the dispensed material is deformed to match the computer model profile within a pre-determined tolerance.