US 12,076,914 B2
Molding device, liquid column moving device, molding method, liquid column moving method, and program
Shoji Maruo, Yokohama (JP); Hiroyuki Tadokoro, Kai (JP); and Hotaka Hirata, Shioya (JP)
Assigned to National University Corporation Yokohama National University, Yokohama (JP)
Appl. No. 17/776,940
Filed by National University Corporation Yokohama National University, Yokohama (JP)
PCT Filed Nov. 18, 2020, PCT No. PCT/JP2020/042987
§ 371(c)(1), (2) Date May 13, 2022,
PCT Pub. No. WO2021/100755, PCT Pub. Date May 27, 2021.
Claims priority of application No. 2019-208227 (JP), filed on Nov. 18, 2019.
Prior Publication US 2022/0396027 A1, Dec. 15, 2022
Int. Cl. B29C 64/124 (2017.01); B29C 64/268 (2017.01); B29C 64/307 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 70/00 (2020.01)
CPC B29C 64/124 (2017.08) [B29C 64/268 (2017.08); B29C 64/307 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12)] 5 Claims
OG exemplary drawing
 
1. A molding device comprising:
a movement processing unit configured to move a liquid column sandwiched between two substrates;
a molding unit configured to perform a molding process so that a solid object is attached to the substrate farther from an irradiation hole of a molding beam by irradiating the molding beam so that a focal point of the molding beam is formed within a prescribed molding region in the liquid column, and by partially changing the liquid column to a solid; and
a substrate control unit configured to control a movement of the substrates so that the substrate to which the solid object is attached separates from the irradiation hole of the molding beam when the molding unit performs the molding process.