US 12,076,891 B2
Profiling device, profiling method, bonding system, bonding method, and display device
Jiafan Shi, Beijing (CN); Liqiang Chen, Beijing (CN); Yaming Wang, Beijing (CN); Dongdong Zhao, Beijing (CN); Chao Zhou, Beijing (CN); Yongchun Jiang, Beijing (CN); and Qian Yin, Beijing (CN)
Assigned to Chengdu BOE OptoelectronicsTechnology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Filed on Feb. 28, 2022, as Appl. No. 17/682,871.
Claims priority of application No. 202110266927.X (CN), filed on Mar. 11, 2021.
Prior Publication US 2022/0288819 A1, Sep. 15, 2022
Int. Cl. B29C 43/02 (2006.01); B29C 43/52 (2006.01); B29C 65/32 (2006.01); B29C 65/78 (2006.01); B29C 43/32 (2006.01); B29L 31/34 (2006.01)
CPC B29C 43/021 (2013.01) [B29C 43/52 (2013.01); B29C 65/32 (2013.01); B29C 65/7814 (2013.01); B29C 2043/3211 (2013.01); B29L 2031/3475 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A profiling device, comprising a profiling jig; wherein
the profiling jig comprises an attaching surface, and the attaching surface is configured to attach a flexible display panel and is provided with a planar state and a profiling state, wherein the attaching surface is switchable between the planar state and the profiling state, the attaching surface is a planar surface in the case that the attaching surface is in the planar state, and the attaching surface is a profiling surface in the case that the attaching surface is in the profiling state, the profiling surface comprising a profiling curved-surface; and
wherein a material of the profiling jig is a shape memory material such that the profiling jig memorizes a structure of the profiling jig in the case that the attaching surface is in the planar state and a structure of the profiling jig in the case that the attaching surface is in the profiling state.