US 12,076,879 B2
Method of processing workpiece
Yoshimasa Kojima, Tokyo (JP); and Atsushi Kubo, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Jan. 27, 2022, as Appl. No. 17/649,123.
Claims priority of application No. 2021-021725 (JP), filed on Feb. 15, 2021.
Prior Publication US 2022/0258369 A1, Aug. 18, 2022
Int. Cl. B26D 5/00 (2006.01); B26D 3/06 (2006.01)
CPC B26D 5/005 (2013.01) [B26D 3/065 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method of processing a semiconductor wafer having devices formed on a face side of the wafer, comprising:
a holding step of holding the face side of the wafer on a holding table having a region made of a transparent material while a reverse side of the wafer is being exposed; and
a processed groove forming step of forming a processed groove in the wafer by cutting the wafer held on the holding table with a cutting blade, wherein
the processed groove forming step includes:
a first processed groove forming step of forming a first processed groove in the wafer, the first processed groove having a predetermined depth short of the face side, with a first cutting blade having a first thickness,
a first image capturing step of capturing an image of the first processed groove on the reverse side of the wafer by a first image capturing unit, the first capturing unit being disposed on a first side of the holding table,
a second processed groove forming step of positioning a second cutting blade that has a second thickness at the first processed groove and forming a second processed groove in the wafer along the first processed groove, the second processed groove extending to the face side, thereby dividing the wafer,
a second image capturing step of capturing an image of the second processed groove on the face side of the wafer through the holding table by a second image capturing unit, the second image capturing unit being disposed on a second, opposite side of the holding table, and
a detecting step of detecting whether or not a position of a first central line of the first processed groove whose image has been captured in the first image capturing step and a position of a second central line of the second processed groove whose image has been captured in the second image capturing step are in conformity with each other in a predetermined plane, and
if the position of the first central line and the position of the second central line are not in conformity with each other in the predetermined plane in the detecting step, then the processed groove forming step further has a correcting step of correcting a position of a center of the cutting blade in order to bring the position of the first central line and the position of the second central line into conformity with each other.