US 12,076,863 B2
Autoteach system
Nicholas Michael Kopec, Sunnyvale, CA (US); Lyle Kosinski, San Jose, CA (US); Matvey Farber, Redwood City, CA (US); and Jeffrey Hudgens, San Francisco, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 27, 2022, as Appl. No. 17/850,296.
Application 17/850,296 is a continuation of application No. 16/708,337, filed on Dec. 9, 2019, granted, now 11,370,114.
Prior Publication US 2022/0324100 A1, Oct. 13, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); B25J 9/16 (2006.01); B25J 21/00 (2006.01); H01L 21/00 (2006.01); H01L 21/673 (2006.01)
CPC B25J 9/163 (2013.01) [B25J 9/1653 (2013.01); B25J 21/005 (2013.01); H01L 21/00 (2013.01); H01L 21/67 (2013.01); H01L 21/6735 (2013.01); G05B 2219/45031 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An autoteach system of a wafer processing system, the autoteach system comprising:
an autoteach pin that is a scannable feature having a fixed position within the autoteach system, wherein the autoteach pin enables an autoteach operation of a robot arm of the wafer processing system, wherein an end effector of the robot arm is to scan the autoteach pin to perform the autoteach operation of the robot arm, wherein the autoteach operation is an operation to automatically teach the fixed position within the autoteach system to the robot arm of the wafer processing system, wherein the autoteach pin comprises:
a first portion comprising a cylindrical sidewall, wherein the robot arm is to use the first portion to locate the fixed position within the autoteach system; and
a second portion comprising planar sidewalls, wherein the robot arm is to scan the second portion to perform a first calibration of robot arm error.