CPC B24B 37/24 (2013.01) [B24B 7/228 (2013.01); B24D 11/00 (2013.01); C08J 9/12 (2013.01); H01L 21/30625 (2013.01); C08J 2375/04 (2013.01)] | 10 Claims |
1. A polishing pad, which comprises a polishing layer comprising a porous polyurethane-based resin, wherein the polishing layer has a swelling ratio of 100% to 350% in dimethylformamide (DMF) based on the volume or weight of the polishing layer, and
the polishing layer has a swelling ratio of 150% to 450% in N-methyl-2-pyrrolidone (NMP) based on the volume or weight of the polishing layer, when the polishing layer is stored in each of DMF and NMP at room temperature for 24 hours.
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