US 12,076,832 B2
Polishing pad with improved crosslinking density and process for preparing the same
Jong Wook Yun, Gyeonggi-do (KR); Eun Sun Joeng, Ulsan (KR); Hye Young Heo, Gyeonggi-do (KR); and Jang Won Seo, Gyeonggi-do (KR)
Assigned to SK ENPULSE CO., LTD., Gyeonggi-Do (KR)
Filed by SKC solmics Co., Ltd., Gyeonggi-do (KR)
Filed on Feb. 14, 2020, as Appl. No. 16/791,881.
Claims priority of application No. 10-2019-0059632 (KR), filed on May 21, 2019.
Prior Publication US 2020/0368873 A1, Nov. 26, 2020
Int. Cl. B24B 37/24 (2012.01); B24B 7/22 (2006.01); B24D 11/00 (2006.01); C08J 9/12 (2006.01); H01L 21/306 (2006.01)
CPC B24B 37/24 (2013.01) [B24B 7/228 (2013.01); B24D 11/00 (2013.01); C08J 9/12 (2013.01); H01L 21/30625 (2013.01); C08J 2375/04 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A polishing pad, which comprises a polishing layer comprising a porous polyurethane-based resin, wherein the polishing layer has a swelling ratio of 100% to 350% in dimethylformamide (DMF) based on the volume or weight of the polishing layer, and
the polishing layer has a swelling ratio of 150% to 450% in N-methyl-2-pyrrolidone (NMP) based on the volume or weight of the polishing layer, when the polishing layer is stored in each of DMF and NMP at room temperature for 24 hours.