| CPC B23K 26/356 (2015.10) [B23K 26/009 (2013.01); B23K 26/0626 (2013.01); B23K 26/0648 (2013.01); B23K 26/0652 (2013.01); B23K 26/0665 (2013.01); B23K 26/083 (2013.01); B23K 26/146 (2015.10); B23K 26/1464 (2013.01); C21D 7/06 (2013.01); C21D 10/005 (2013.01)] | 12 Claims |
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1. A laser peening processing device comprising:
a laser oscillator configured to oscillate a laser beam;
a nozzle configured to inject liquid to a workpiece for laser peening processing, and to cause the laser beam to be incident on the liquid and propagate through the liquid to irradiate the workpiece with the laser beam;
a robot arm configured to hold a first workpiece having a first weight;
a drive mechanism comprising a table on which a second workpiece having a second weight is disposed, the first weight is lighter than the second weight;
a first controller programed to (1) move the robot arm to place the first workpiece at a processing position where the first workpiece is irradiated with the laser beam, and (2) retract the robot arm from the processing position when the second workpiece is processed at the processing position; and
a second controller programed to (1) move the drive mechanism to place the second workpiece at the processing position where the second workpiece is irradiated with the laser beam, and (2) retract the drive mechanism from the processing position when the first workpiece is processed at the processing position,
wherein the nozzle comprises:
a cylindrical casing in which an optical path of the laser beam is formed such that the cylindrical casing protects the laser beam before the laser beam is incident on the liquid;
a lens disposed on the optical path of the laser beam in the cylindrical casing, the lens being configured to concentrate the laser beam so that a focal point of the laser beam is formed at the processing position of the laser peening processing;
a prism disposed on the optical path of the laser beam, the prism being configured to i) receive the laser beam on an incident surface of the prism, ii) change a traveling direction of the laser beam from a first direction to a second direction that differs from the first direction, and iii) emit the received laser beam from an emission surface of the prism, wherein the second direction extends from a top of the laser peening processing device to a bottom of the laser peening processing device; and
a pipe disposed in the cylindrical casing, and configured to form a flow path for the liquid,
wherein an exit of the pipe is disposed between the prism and the workpiece to form a column of the liquid extending from the emission surface of the prism to a surface of the workpiece in the second direction,
wherein the laser beam emitted from the emission surface of the prism i) propagates through an entire length of the column of the liquid extending from the emission surface of the prism to the surface of the workpiece in the second direction and ii) radiates the surface of the workpiece covered with the liquid,
wherein the laser peening processing device further comprises a liquid collection system configured to collect the liquid injected through the nozzle, and
wherein the liquid collection system comprises:
a first liquid receiver, fixed to the table of the drive mechanism, configured to collect the liquid from the nozzle and discharge the liquid from a first discharge outlet;
a second liquid receiver, disposed at the processing position during the laser peening processing using the robot arm or fixed to the robot arm, configured to collect the liquid from the nozzle and discharge the liquid from a second discharge outlet; and
a flow path configured to allow the liquid discharged through the first and second discharge outlets to flow.
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