US 12,076,525 B2
Thermal management system and method for medical devices
Kevin P. McLennan, Chicago, IL (US); and John C. Hoenninger, III, Deerfield, IL (US)
Assigned to ICU Medical, Inc., San Clemente, CA (US)
Filed by ICU Medical, Inc., San Clemente, CA (US)
Filed on Dec. 22, 2021, as Appl. No. 17/645,543.
Application 17/645,543 is a continuation of application No. 16/048,106, filed on Jul. 27, 2018, granted, now 11,213,619.
Application 16/048,106 is a continuation of application No. 15/592,059, filed on May 10, 2017, granted, now 10,034,975.
Application 15/592,059 is a continuation of application No. 14/538,339, filed on Nov. 11, 2014, abandoned.
Claims priority of provisional application 61/902,495, filed on Nov. 11, 2013.
Prior Publication US 2022/0362457 A1, Nov. 17, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. A61M 5/14 (2006.01); A61M 5/142 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01)
CPC A61M 5/1415 (2013.01) [A61M 5/14 (2013.01); A61M 5/142 (2013.01); G06F 1/20 (2013.01); H05K 7/20 (2013.01); H05K 7/20436 (2013.01); A61M 2205/3372 (2013.01); A61M 2209/082 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A medical device, comprising:
a fastener configured to be in thermally conductive contact with a thermally conductive mounting clamp; and a power supply configured to dissipate heat generated from the power supply into a heat shield configured to conduct heat away from the power supply and a handle into the fastener, the fastener configured to conduct heat from the fastener into the thermally conductive mounting clamp.