US D1,091,310 S
Package with surface ornamentation
Michael Schoppe, Selters (DE)
Assigned to STAEDTLER SE, Nuremberg (DE)
Filed by STAEDTLER SE, Nuremberg (DE)
Filed on Oct. 25, 2024, as Appl. No. 29/970,074.
Application 29/970,074 is a continuation in part of application No. 35/516,362, filed on Jan. 20, 2023, with international filing date Jan. 20, 2023, abandoned.
Claims priority of application No. DM/226637 (WO), filed on Jan. 20, 2023.
Term of patent 15 Years
LOC (15) Cl. 09 - 07
U.S. Cl. D 9—434  [D9/415]
OG exemplary drawing
 
The ornamental design for a package with surface ornamentation as shown and described.