| CPC H10N 10/17 (2023.02) | 9 Claims |

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1. A T-type thermoelectric conversion module comprising:
an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other;
a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and
a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, wherein:
the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material,
both surfaces of the T-type thermoelectric conversion module are provided with no support base material, and
a hardenable pressure sensitive adhesion agent layer which is configured to fill all voids composed of the area between the adjacent first electrodes or the adjacent second electrodes and the insulator is provided on at least one surface of the T-type thermoelectric conversion module.
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