US 12,408,508 B2
Encapsulation film
Yeong Bong Mok, Daejeon (KR); Hyun Jee Yoo, Daejeon (KR); Jung Ok Moon, Daejeon (KR); Kyung Yul Bae, Daejeon (KR); Jung Woo Lee, Daejeon (KR); and Se Woo Yang, Daejeon (KR)
Assigned to LG CHEM, LTD., Seoul (KR)
Appl. No. 15/734,303
Filed by LG CHEM, LTD., Seoul (KR)
PCT Filed Jun. 5, 2019, PCT No. PCT/KR2019/006809
§ 371(c)(1), (2) Date Dec. 2, 2020,
PCT Pub. No. WO2019/235850, PCT Pub. Date Dec. 12, 2019.
Claims priority of application No. 10-2018-0065023 (KR), filed on Jun. 5, 2018.
Prior Publication US 2021/0226157 A1, Jul. 22, 2021
Int. Cl. H10K 50/844 (2023.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 15/082 (2006.01); B32B 15/20 (2006.01); H10K 50/84 (2023.01); H10K 50/87 (2023.01)
CPC H10K 50/844 (2023.02) [B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/082 (2013.01); B32B 15/20 (2013.01); H10K 50/846 (2023.02); H10K 50/87 (2023.02); B32B 2307/302 (2013.01); B32B 2307/584 (2013.01); B32B 2307/732 (2013.01); B32B 2457/206 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An encapsulation film for an organic electronic element, comprising an encapsulation layer which encapsulates an organic electronic element, and two or more metal layers,
wherein the metal layers comprise a first layer having a thermal conductivity of 50 to 800 W/m·K and a second layer having a linear expansion coefficient of 20 ppm/° C. or less,
wherein the second layer has a thermal conductivity lower than that of the first layer and the first layer has a linear expansion coefficient higher than that of the second layer,
wherein the first layer and the second layer are attached to each other by a pressure-sensitive adhesive or a structural adhesive such that the first layer, the pressure-sensitive adhesive or the structural adhesive, and the second layer are sequentially laminated,
wherein the encapsulation layer, the second layer and the first layer are laminated in this order, and wherein the second layer has magnetism, and
wherein the pressure-sensitive adhesive or the structural adhesive are urethane-based pressure-sensitive adhesive or urethane-based structural adhesive.