US 12,408,496 B2
Patterned deposition mask formed using polymer dispersed in a liquid solvent
Jens Meyer, Cologne (DE); Marinus Johannes Petrus Maria van Gerwen, Aachen (DE); and Ronja Missong, Aachen (DE)
Assigned to Lumileds Singapore Pte. Ltd., Singapore (SG)
Filed by LUMILEDS LLC, San Jose, CA (US)
Filed on Oct. 25, 2022, as Appl. No. 17/973,007.
Claims priority of provisional application 63/273,578, filed on Oct. 29, 2021.
Prior Publication US 2023/0138348 A1, May 4, 2023
Int. Cl. H10H 20/851 (2025.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01)
CPC H10H 20/8513 (2025.01) [H01L 21/02282 (2013.01); H01L 21/0274 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
(a) forming a polymer dispersion layer on a substrate having one or more semiconductor light-emitting devices mounted or formed thereon, the polymer dispersion layer comprising polymer particles dispersed in a liquid solvent and being present on at least portions of the substrate or the one or more semiconductor light-emitting devices thereon;
(b) after forming the polymer dispersion layer, drying and curing the polymer dispersion layer to form a cured polymer layer;
(c) after curing and drying, with the cured polymer layer being present on only one or more selected, masked areas of the substrate or of the one or more light-emitting devices thereon, and with one or more other, exposed areas of the substrate or of the one or more light-emitting devices thereon lacking the cured polymer layer and remaining exposed, forming a material layer on at least the one or more exposed areas of the substrate or of the one or more light-emitting devices thereon; and
(d) after forming the material layer, removing the cured polymer layer from the one or more masked areas, leaving the material layer on only the one or more exposed areas.