US 12,408,483 B2
Micro-LED structure and micro-LED chip including same
Qiming Li, Albuquerque, NM (US); Yuankun Zhu, Shanghai (CN); Anle Fang, Shanghai (CN); Deshuai Liu, Shanghai (CN); and Jian Guo, Shanghai (CN)
Assigned to Jade Bird Display (Shanghai) Limited, Shanghai (CN)
Filed by JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai (CN)
Filed on Dec. 27, 2021, as Appl. No. 17/562,419.
Claims priority of provisional application 63/131,128, filed on Dec. 28, 2020.
Prior Publication US 2022/0209060 A1, Jun. 30, 2022
Int. Cl. H10H 20/812 (2025.01); H01L 25/075 (2006.01); H10H 20/81 (2025.01); H10H 20/811 (2025.01); H10H 20/814 (2025.01); H10H 20/819 (2025.01); H10H 20/821 (2025.01); H10H 20/83 (2025.01); H10H 20/831 (2025.01); H10H 20/841 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); H10H 29/10 (2025.01); H10H 29/14 (2025.01)
CPC H10H 20/812 (2025.01) [H01L 25/0753 (2013.01); H10H 20/81 (2025.01); H10H 20/811 (2025.01); H10H 20/814 (2025.01); H10H 20/819 (2025.01); H10H 20/821 (2025.01); H10H 20/831 (2025.01); H10H 20/841 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); H10H 29/10 (2025.01); H10H 29/14 (2025.01); H10H 20/83 (2025.01)] 21 Claims
OG exemplary drawing
 
1. A micro-LED chip including multiple micro-LEDs, wherein,
at least one micro-LED comprises:
a first type conductive layer;
a second type conductive layer stacked on the first type conductive layer; and
a light emitting layer formed between the first type conductive layer and the second type conductive layer, wherein the light emitting layer extends along a horizontal level from a top edge of the first type conductive layer and from a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not contact the top edge of the first type conductive layer and the bottom edge of the second type conductive layer, and the bottom edge of the second type conductive layer is aligned with the top edge of the first type conductive layer,
the micro-LED chip further comprises a metal layer formed on the light emitting layer between adjacent micro-LEDs, and
a lateral dimensional value of the metal layer is not more than a distance between an edge of the light emitting layer and the top edge of the first type conductive layer.