US 12,408,465 B2
Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly
Zhen Huang, Zhejiang (CN); Zhongyu Luan, Zhejiang (CN); Yinbo Zhang, Zhejiang (CN); Fengsheng Xi, Zhejiang (CN); and Hongfeng Gan, Zhejiang (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Appl. No. 17/770,744
Filed by NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
PCT Filed Oct. 21, 2020, PCT No. PCT/CN2020/122405
§ 371(c)(1), (2) Date Apr. 21, 2022,
PCT Pub. No. WO2021/078138, PCT Pub. Date Apr. 29, 2021.
Claims priority of application No. 201910999211.3 (CN), filed on Oct. 21, 2019; and application No. 201910999377.5 (CN), filed on Oct. 21, 2019.
Prior Publication US 2022/0367556 A1, Nov. 17, 2022
Int. Cl. H01L 27/146 (2006.01); H10F 39/00 (2025.01)
CPC H10F 39/811 (2025.01) [H10F 39/804 (2025.01); H10F 39/8057 (2025.01); H10F 39/806 (2025.01)] 18 Claims
OG exemplary drawing
 
1. A photosensitive assembly, characterized by comprising:
a circuit board, which includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on a lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium and the circuit board electrical connecting terminals; and
a photosensitive chip, wherein an upper surface of the photosensitive chip includes a photosensitive area, a non-photosensitive area located around the photosensitive area, and chip electrical connecting terminals disposed in the non-photosensitive area;
wherein the chip electrical connecting terminals of the photosensitive chip correspond to the circuit board electrical connecting terminals, and the chip electrical connecting terminals are in contact with the conducting medium to be electrically connected to the circuit board electrical connecting terminals, and the photosensitive chip is bonded to the lower surface of the circuit board via the non-conducting adhesive, so that the photosensitive chip is electrically connected to the circuit board;
wherein the photosensitive area of the photosensitive chip corresponds to the through hole, so that external light reach the photosensitive area via the through hole;
wherein the chip electrical connecting terminals are pressed against the conducting medium to be electrically connected to the circuit board electrical connecting terminals; and
during the process of electrically connecting the photosensitive chip to the circuit board, the photosensitive assembly is heated to a specific temperature range, and the conducting medium has deformable property within the specific temperature range, and the non-conducting adhesive is cured in the specific temperature range.