| CPC H10D 62/151 (2025.01) [H10D 64/256 (2025.01); H10D 86/201 (2025.01)] | 20 Claims |

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1. A structure comprising:
a silicon-on-insulator substrate including a semiconductor layer, a semiconductor substrate, and a dielectric layer between the semiconductor layer and the semiconductor substrate, the semiconductor substrate including a first doped region and a second doped region, the first doped region having a first conductivity type, and the second doped region having a second conductivity type different from the first conductivity type;
a first source/drain region in the semiconductor layer, the first source/drain region overlapping with the first doped region;
a second source/drain region in the semiconductor layer, the second source/drain region overlapping with the second doped region; and
a first gate structure laterally between the first source/drain region and the second source/drain region,
wherein the semiconductor substrate includes a third doped region having the second conductivity type, the first doped region is laterally positioned between the second doped region and the third doped region, the first gate structure has a width, and the second doped region is laterally spaced from the third doped region by a distance greater than two times the width of the first gate structure.
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