US 12,408,385 B2
Thin-film transistor substrate, manufacturing method thereof, and display apparatus employing the thin-film transistor substrate
Jongoh Seo, Yongin-si (KR); Janghyun Kim, Yongin-si (KR); Jongjun Baek, Yongin-si (KR); and Dongmin Lee, Yongin-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Jun. 21, 2022, as Appl. No. 17/845,301.
Claims priority of application No. 10-2021-0136893 (KR), filed on Oct. 14, 2021.
Prior Publication US 2023/0395728 A1, Dec. 7, 2023
Int. Cl. H10D 30/67 (2025.01); H10D 30/01 (2025.01); H10K 59/121 (2023.01); H10K 59/80 (2023.01)
CPC H10D 30/6757 (2025.01) [H10D 30/0321 (2025.01); H10K 59/1213 (2023.02); H10K 59/1216 (2023.02); H10K 59/873 (2023.02)] 18 Claims
OG exemplary drawing
 
1. A thin-film transistor substrate comprising:
a substrate;
a buffer layer on the substrate;
a semiconductor layer arranged on a top surface of the buffer layer and comprising a first conductive area, a second conductive area, and a channel area between the first conductive area and the second conductive area;
a first dopant doped in an upper portion of the channel area at a first concentration;
a second dopant doped in a lower portion of the channel area at a second concentration and being of a different type from a type of the first dopant;
a gate insulating layer covering the semiconductor layer;
a gate electrode overlapping the channel area in a plan view and disposed on the gate insulating layer; and
a barrier layer disposed under a bottom surface of the buffer layer,
wherein the first dopant is doped in the barrier layer.