US 12,408,380 B2
Display panel including light-absorbing layer
Chuanbao Luo, Shenzhen (CN)
Assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shenzhen (CN)
Appl. No. 17/436,142
Filed by SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shenzhen (CN)
PCT Filed Aug. 10, 2021, PCT No. PCT/CN2021/111704
§ 371(c)(1), (2) Date Sep. 3, 2021,
PCT Pub. No. WO2022/247017, PCT Pub. Date Dec. 1, 2022.
Claims priority of application No. 202110571662.4 (CN), filed on May 25, 2021.
Prior Publication US 2022/0384767 A1, Dec. 1, 2022
Int. Cl. H10K 50/86 (2023.01); H10D 30/67 (2025.01); H10K 71/00 (2023.01)
CPC H10K 50/865 (2023.02) [H10D 30/6755 (2025.01); H10D 30/6757 (2025.01); H10K 71/00 (2023.02)] 16 Claims
OG exemplary drawing
 
1. A display panel, comprising: a base substrate, a light-absorbing layer, and a driving circuit layer stacked in sequence, wherein the driving circuit layer comprises a first metal layer and an active layer, the first metal layer comprises a first electrode and a second electrode spaced apart in a same layer, and the active layer is disposed on the first metal layer and comprises a channel region; and
wherein a vertical projection of the light-absorbing layer on the base substrate covers a vertical projection of a gap between the first electrode and the second electrode on the base substrate;
wherein the vertical projection of the light-absorbing layer on the base substrate coincides with the vertical projection of the gap on the base substrate;
wherein the active layer comprises at least one via hole, and a vertical protection of the via hole on the base substrate does not overlap the vertical projection of the light-absorbing layer on the base substrate; and
wherein the display panel further comprises an LED light-shielding layer disposed on a side of the driving circuit layer away from the light-absorbing layer, and a vertical protection of the LED light-shielding layer on the base substrate covers the vertical protection of the via hole on the base substrate.