US 12,408,305 B2
Heat dissipation structure and electronic device using same
Fu-Hung Hsu, Hsinchu (TW)
Assigned to ALPHA NETWORKS INC., Hsinchu (TW)
Filed by ALPHA NETWORKS INC., Hsinchu (TW)
Filed on Aug. 11, 2023, as Appl. No. 18/233,047.
Claims priority of application No. 112119381 (TW), filed on May 24, 2023.
Prior Publication US 2024/0397670 A1, Nov. 28, 2024
Int. Cl. H05K 7/20 (2006.01); H01Q 1/02 (2006.01)
CPC H05K 7/20481 (2013.01) [H01Q 1/02 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A heat dissipation structure, disposed in an electronic device; the electronic device comprises a circuit board and an antenna disposed on the circuit board; the heat dissipation structure comprising:
a first heat dissipation member disposed on the circuit board, wherein the first heat dissipation member is made of a thermally conductive material; and
a second heat dissipation member disposed close to the antenna, wherein a projection of the second heat dissipation member on an output surface of the antenna at least covers a portion of the output surface of the antenna; the second heat dissipation member is in contact with the first heat dissipation member; the second heat dissipation member is made of a plastic material, wherein the plastic material is mixed with a plurality of ceramic particles, wherein the second heat dissipation member comprises a first portion and a second portion connected to the first portion; a projection of the first portion on the output surface of the antenna at least covers the portion of the output surface of the antenna; the second portion has a first surface and a second surface opposite to the first surface, wherein the first surface faces the circuit board, and the second surface is tightly attached to the first heat dissipation member.