US 12,408,304 B1
High-temperature resistant solid-state relay
Chenzhong Yin, Wuxi (CN); Zi Yin, Wuxi (CN); Tianchi Ma, Wuxi (CN); Xingcheng Zhu, Wuxi (CN); and Yan Lv, Wuxi (CN)
Assigned to Jiangsu Gold Electric Control Technology Co., Ltd., Wuxi (CN)
Filed by Jiangsu Gold Electric Control Technology Co., Ltd., Wuxi (CN)
Filed on Mar. 4, 2025, as Appl. No. 19/069,918.
Claims priority of application No. 202410401560.1 (CN), filed on Apr. 3, 2024.
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 5/10 (2025.01)
CPC H05K 7/2039 (2013.01) [H05K 1/0203 (2013.01); H05K 5/10 (2025.01); H05K 2201/10166 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A high-temperature resistant solid-state relay, comprising a bottom board, a switch component, a Printed Circuit Board (PCB), a frame body for protecting the PCB, and a top cover; wherein
an upper surface of the bottom board is fixed with the switch component; the frame body is fixed with the bottom board; the PCB is embedded in the frame body; and the switch component is connected with the PCB;
the PCB is provided with a large output copper column, a large input copper column, a small output control signal copper column and a small input control signal copper column; the large output copper column and the large input copper column are juxtaposed at one side, and an arrangement direction of the large output copper column and the large input copper column is regarded as a first arrangement direction; the small output control signal copper column and the small input control signal copper column are juxtaposed at an other side, and an arrangement direction of the small output control signal copper column and the small input control signal copper column is regarded as a second arrangement direction; the first arrangement direction is parallel to the second arrangement direction; the large output copper column and the small input control signal copper column are located on one same straight line; the large input copper column and the small output control signal copper column are located on an other same straight line; and top ends of the large output copper column, the large input copper column, the small output control signal copper column and the small input control signal copper column are provided with screw holes;
the top cover is located above the frame body; the top cover is formed with fixing holes corresponding to the screw holes on the top ends of the large output copper column, the large input copper column, the small output control signal copper column and the small input control signal copper column; and the top cover is fixed with the PCB through first bolts;
wherein the high-temperature resistant solid-state relay further comprises a heat dissipation rack;
the heat dissipation rack is fixed with the bottom board; and the heat dissipation rack is located below the PCB;
the bottom board is made of a first high-temperature resistant material; the first high-temperature resistant material is aluminum, which has a temperature resistant range up to 200° C.; the heat dissipation rack, the frame body, the PCB and the top cover are made of a second high-temperature resistant material; the second high-temperature resistant material is ceramic, which has a temperature resistance range of 200° C.-300° C.;
the switch component is a carbonized Metal Oxide Semiconductor (mos) field-effect transistor; and a pin of the switch component is connected with the PCB.