US 12,408,303 B2
Elastomer embedded multipoint contact cooling
Harvey J. Lunsman, Chippewa Falls, WI (US); and Steven Dean, Chippewa Falls, WI (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Houston, TX (US)
Filed on Jul. 27, 2022, as Appl. No. 17/815,296.
Prior Publication US 2024/0040748 A1, Feb. 1, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/2039 (2013.01) [H05K 1/0203 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A cooling assembly of a host circuit device, comprising:
a cooling component; and
a thermal gap pad comprising an elastomer component movably connected to the cooling component and a plurality of beams embedded in the elastomer component, wherein a first end portion of each of one or more beams of the plurality of beams is disposed in a first thermal contact with the cooling component and a second end portion of each of the one or more beams is disposed in a second thermal contact with a heat sink of a removable circuit device, wherein the second end portion of each of the plurality of beams includes an electrically insulating layer, wherein the elastomer component is an elastic and thermally non-conductive component, and wherein each beam of the plurality of beams is a non-elastic and thermally conductive component.