US 12,408,301 B2
Thermal module and joining method for hermetically sealed enclosure of a thermal module using a capillary joint
Anthony J. Aiello, Santa Cruz, CA (US); Chetan Harsha Edara, Santa Clara, CA (US); and Pavan Kumar Varma Buddaraju, Milpitas, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on May 19, 2023, as Appl. No. 18/199,851.
Prior Publication US 2024/0389269 A1, Nov. 21, 2024
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20336 (2013.01) [G06F 1/203 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A thermal module, comprising:
a first part comprising a first wall;
a second part comprising a second wall, wherein the second wall is angled such that the second wall is non-parallel with respect to the first wall to define a diverging portion, and the first wall and the second wall define a gap based on the diverging portion; and
a bonding paste configured to:
extend along and fill the gap between the first wall and the second wall,
secure and engage the first wall with the second wall at the diverging portion, and
provide a hermetic seal between the first wall and the second wall.