US 12,408,300 B2
Cooling system
Ren-Chun Chang, Taoyuan (TW); Shao-Hsuan Lai, Taoyuan (TW); and Siang-Lin You, Taoyuan (TW)
Assigned to DELTA ELECTRONICS, INC., Taoyuan (TW)
Filed by DELTA ELECTRONICS, INC., Taoyuan (TW)
Filed on Feb. 10, 2023, as Appl. No. 18/167,078.
Claims priority of application No. 202211304824.9 (CN), filed on Oct. 24, 2022.
Prior Publication US 2024/0138113 A1, Apr. 25, 2024
Prior Publication US 2024/0237287 A9, Jul. 11, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20318 (2013.01) [H05K 7/20136 (2013.01); H05K 7/203 (2013.01); H05K 7/20309 (2013.01); H05K 7/20327 (2013.01); H05K 7/20818 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling system, comprising:
an air-cooling device, comprising:
a first fan, arranged in a first cooling room and configured to blow a hot air inside a rack into a first cooling room;
an evaporator, arranged in the first cooling room;
a first condenser, arranged in a second cooling room; and
a second fan, arranged in the second cooling room and configured to blow an outside air into the second cooling room;
wherein, in response to the evaporator receiving the hot air through the first fan, the evaporator is configured to heat a refrigerant into a gaseous state and transmit the refrigerant to the first condenser through a first pipeline;
in response to the first condenser receiving the outside air through the second fan, the first condenser is configured to condense the refrigerant into a liquid state and transmit the refrigerant to the evaporator through a second pipeline; and
a water-cooling device, comprising:
a radiator, arranged in the second cooling room and configured to receive a hot liquid from an electronic device in the rack through a third pipeline and transmit a cold liquid to the electronic device through a fourth pipeline;
wherein, in response to the radiator receiving the outside air through the second fan, the radiator is configured to cool down the hot liquid to the cold liquid.