US 12,408,296 B2
Power device embedded printed circuit board-cold plate assemblies with low interfacial thermal and mechanical stresses and methods of making the same
Feng Zhou, Ann Arbor, MI (US); Tianzhu Fan, Houston, TX (US); and Yanghe Liu, Ann Arbor, MI (US)
Assigned to Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US)
Filed by Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US)
Filed on Feb. 27, 2023, as Appl. No. 18/114,622.
Prior Publication US 2024/0292564 A1, Aug. 29, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20254 (2013.01) [H05K 1/0272 (2013.01); H05K 7/20927 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An assembly comprising:
a cold plate;
a power electronics embedded printed circuit board (PCB); and
a low thermal resistance (LTR) dielectric layer in direct contact with and directly bonded to the cold plate, the LTR dielectric layer sandwiched between the cold plate and the power electronics embedded PCB such that the power electronics embedded PCB is bonded to the cold plate via the LTR dielectric layer to form a highly integrated power electronics embedded PCB—cold plate assembly.