US 12,408,292 B2
Wireless charger
Miaomiao Zeng, Dongguan (CN); Chao Yang, Dongguan (CN); Zhipeng Guan, Shenzhen (CN); Yong Wang, Dongguan (CN); Zhao Wang, Dongguan (CN); Yanan Gong, Dongguan (CN); Li He, Dongguan (CN); Guli Zhu, Shenzhen (CN); Tong Gu, Chengdu (CN); and Xiaozhen Li, Dongguan (CN)
Assigned to Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed by Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed on Jul. 6, 2023, as Appl. No. 18/347,831.
Claims priority of application No. 202210795078.1 (CN), filed on Jul. 7, 2022.
Prior Publication US 2024/0015923 A1, Jan. 11, 2024
Int. Cl. H05K 7/20 (2006.01); H02J 50/00 (2016.01)
CPC H05K 7/20154 (2013.01) [H02J 50/005 (2020.01)] 15 Claims
OG exemplary drawing
 
1. A wireless charger, comprising:
an upper housing assembly;
a lower housing assembly;
a magnetic sheet coil; and
a heat dissipation ring, wherein a concave structure is provided on an upper surface of the lower housing assembly, the concave structure is coupled to the upper housing assembly to form a cavity structure, the magnetic sheet coil is sleeved outside the heat dissipation ring, and a gap among the upper housing assembly, the concave structure, the magnetic sheet coil, and the heat dissipation ring is filled with a thermally conductive adhesive;
an upper surface of the heat dissipation ring is coupled to a lower surface of the upper housing assembly, a lower surface of the heat dissipation ring is coupled to a bottom of the concave structure of the lower housing assembly, and an outer side surface of the heat dissipation ring is coupled to the magnetic sheet coil, wherein the upper surface of the heat dissipation ring is a surface that is of the heat dissipation ring and that is close to the upper housing assembly, the lower surface of the heat dissipation ring is a surface that is of the heat dissipation ring and that is close to the bottom of the concave structure of the lower housing assembly, and the lower surface of the upper housing assembly is a surface that is of the upper housing assembly and that constitutes the cavity structure; and
the heat dissipation ring is configured to conduct heat of the upper housing assembly and the magnetic sheet coil to the bottom of the concave structure of the lower housing assembly.