US 12,408,290 B2
Thermal management in data storage device
Tew Wei Hong, Simpang Ampat (MY); Chan Tze Ping, Jawi (MY); Lau Chun Sean, Bayan Lepas (MY); Heng JunJeen, Hutan Melintang (MY); Tan Yi Chun, Bayan Lepas (MY); and Wong Guohonn, Bayan Lepas (MY)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Sandisk Technologies, Inc., Milpitas, CA (US)
Filed on Aug. 11, 2023, as Appl. No. 18/448,656.
Claims priority of provisional application 63/491,768, filed on Mar. 23, 2023.
Prior Publication US 2024/0324136 A1, Sep. 26, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20145 (2013.01) [H05K 1/0203 (2013.01); H05K 7/20727 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10545 (2013.01)] 20 Claims
OG exemplary drawing
 
6. A data storage device, comprising:
a housing including a first section, a second section, a third section, a first aperture that defines an angled airflow inlet, and a second aperture that defines an angled airflow outlet, the first aperture positioned between the first section and the second section, and the second aperture positioned between the second section and the third section,
the angled airflow inlet and the angled airflow outlet configured to direct airflow through the second section of the housing;
a printed circuit board assembly (“PCBA”) disposed in the housing, the PCBA including a plurality of active components arranged in a first area corresponding to the second section and a plurality of passive components arranged in a second area and a third area corresponding to the first section and the third section, respectively; and
a second airflow inlet and a second airflow outlet together configured to direct airflow through an airflow channel in the first section, the second section, and third section of the housing, wherein each of the plurality of passive components are arranged adjacent to the airflow channel.