| CPC H05K 5/0018 (2022.08) [H05K 1/16 (2013.01); H05K 3/0011 (2013.01); H05K 3/301 (2013.01); H05K 3/321 (2013.01); H05K 3/3457 (2013.01); H05K 5/0069 (2013.01)] | 13 Claims |

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1. A circuit board comprising:
a board including a first surface and a second surface opposing the first surface, wherein the board includes at least one conductive layer and at least one insulating layer;
a plurality of electronic elements disposed on the first surface of the board;
a plurality of resistive pads disposed on the second surface of the board and electrically connected to at least one selected from the electronic elements; and
a conductive pattern disposed on the resistive pads,
wherein the resistive pads are disposed between the electronic elements and the conductive pattern in a thickness direction of the board such that a portion of the resistive pads in direct contact with the conductive pattern overlaps the electric component in the thickness direction,
wherein the at least one conductive layer and the at least one insulating layer extend parallel to each other along a plane perpendicular to the thickness direction of the board, and
wherein the resistive pads have a resistance of zero ohm.
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