US 12,408,277 B2
Component-attached FPC manufacturing method
Hidehiko Shimizu, Makinohara (JP)
Assigned to YAZAKI CORPORATION, Tokyo (JP)
Filed by Yazaki Corporation, Tokyo (JP)
Filed on Aug. 15, 2024, as Appl. No. 18/805,678.
Claims priority of application No. 2023-134658 (JP), filed on Aug. 22, 2023.
Prior Publication US 2025/0071910 A1, Feb. 27, 2025
Int. Cl. B23K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01)
CPC H05K 3/341 (2013.01) [B23K 1/0016 (2013.01); H05K 1/189 (2013.01); H05K 3/3494 (2013.01); B23K 2101/42 (2018.08)] 5 Claims
OG exemplary drawing
 
1. A component-attached FPC manufacturing method for manufacturing a component-attached FPC in which a circuit component is solder-bonded to an FPC, comprising:
an FPC forming step of forming an FPC that integrally includes an FPC body, an FPC arm portion branching off from the FPC body, a component mounting portion provided on an end portion of the FPC arm portion and on which the circuit component is mounted, and a bridge connecting the component mounting portion and the FPC body;
a component mounting step of mounting the circuit component on the component mounting portion via a solder; and
an implementing step of heating the FPC, melting the solder, and implementing the circuit component on the component mounting portion.