| CPC H05K 3/0014 (2013.01) [G06K 1/02 (2013.01); G06K 19/07722 (2013.01); G06K 19/07743 (2013.01); H05K 3/22 (2013.01)] | 16 Claims |

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1. A method for manufacturing flexible printed circuits for smart card modules wherein a complex material is provided,
said complex material being in the form of a thin board or strip, with two main faces and being flexible so as to be able to be curved in a direction perpendicular to its main faces, this complex material forming an assembly comprising at least two different-colored strata of dielectric material, and
this complex material further comprising at least one layer of electrically conductive material in contact with one stratum of the assembly comprising at least two different-colored strata of dielectric material, this stratum containing an epoxy resin, contacts being formed in the layer of electrically conductive material, these contacts being intended to establish an electrical connection with a smart card reader, the assembly comprising at least two different-colored strata of dielectric material being visible through the layer of electrically conductive material in at least one zone,
this manufacturing method being characterized in that it comprises an operation that consists in laser etching at least one of the two different-colored strata over a portion of that zone of the assembly comprising at least two different-colored strata of dielectric material that is left visible, so as to reveal the color of the other of the two different-colored strata.
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