US 12,408,255 B2
Cooling device
Kenta Emori, Kanagawa (JP); Jumpei Niida, Kanagawa (JP); Emi Takahashi, Kanagawa (JP); and Shigeharu Yamagami, Kanagawa (JP)
Assigned to Nissan Motor Co., Ltd., Yokohama (JP)
Appl. No. 18/833,455
Filed by Nissan Motor Co., Ltd., Yokohama (JP)
PCT Filed Feb. 15, 2022, PCT No. PCT/IB2022/000071
§ 371(c)(1), (2) Date Jul. 26, 2024,
PCT Pub. No. WO2023/156804, PCT Pub. Date Aug. 24, 2023.
Prior Publication US 2025/0142707 A1, May 1, 2025
Int. Cl. H05K 7/20 (2006.01); H05H 1/24 (2006.01)
CPC H05H 1/2439 (2021.05) [H05K 7/20145 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A cooling device comprising:
a heat sink including a base plate and a plurality of fins provided upright and parallel to one another on the base plate such that at least one flow path is formed between a pair of adjacent fins among the plurality of fins; and
a first plasma actuator arranged between the pair of adjacent fins in the at least one flow path, the first plasma actuator including an electrolyte layer, an upstream electrode, and a downstream electrode,
the first plasma actuator being spaced apart from each of the pair of adjacent fins,
the upstream electrode and the downstream electrode being arranged offset from each other in a flow path direction, and
the first plasma actuator being configured to generate an induced air flow flowing in a central region between the pair of adjacent fins when an AC voltage is applied across the upstream electrode and the downstream electrode, the induced air flow flowing in the flow path direction.