US 12,407,974 B2
Multi frequency acoustic emission micromachined transducers for non-destructive evaluation of structural health
Didem Ozevin, Chicago, IL (US)
Assigned to THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS, Urbana, IL (US)
Appl. No. 17/628,999
Filed by The Board of Trustees of the University of Illinois, Urbana, IL (US)
PCT Filed Jul. 23, 2020, PCT No. PCT/US2020/043282
§ 371(c)(1), (2) Date Jan. 21, 2022,
PCT Pub. No. WO2021/016458, PCT Pub. Date Jan. 28, 2021.
Claims priority of provisional application 62/877,593, filed on Jul. 23, 2019.
Prior Publication US 2022/0326188 A1, Oct. 13, 2022
Int. Cl. H04R 1/24 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01); G01N 29/14 (2006.01)
CPC H04R 1/24 (2013.01) [B81B 3/0021 (2013.01); B81B 7/0032 (2013.01); G01N 29/14 (2013.01); B81B 2201/0271 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81B 2207/01 (2013.01); H04R 2201/003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectromechanical systems (MEMS) acoustic emissions (AE) transducer system comprising:
at least first and second MEMS AE transducers integrated together in a chip, the first and second MEMS AE transducers operating over at least first and second frequency ranges, respectively, that are separate from one another, the first and second MEMS AE transducers generating first and second electrical responses in response to receiving acoustic emissions in the first and second frequency ranges, respectively, the first and second electrical responses being output from the chip, where the first and second electrical responses are continuously electrically combined to generate a combined electrical response on the chip.