US 12,407,908 B2
Heatsink of an image capture device
Nicholas Vitale, Foster City, CA (US); Raul Vargas Gonzalez, Redwood City, CA (US); and Herman Wong, Millbrae, CA (US)
Assigned to GoPro, Inc., San Mateo, CA (US)
Filed by GoPro, Inc., San Mateo, CA (US)
Filed on Jun. 16, 2023, as Appl. No. 18/210,817.
Application 18/210,817 is a continuation of application No. 17/378,992, filed on Jul. 19, 2021, granted, now 11,689,790.
Application 17/378,992 is a continuation in part of application No. 16/803,139, filed on Feb. 27, 2020, granted, now 11,277,545, issued on Mar. 15, 2022.
Prior Publication US 2023/0328345 A1, Oct. 12, 2023
Int. Cl. H04N 23/51 (2023.01); G03B 17/12 (2021.01); G03B 17/56 (2021.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); G03B 17/55 (2021.01)
CPC H04N 23/51 (2023.01) [G03B 17/12 (2013.01); G03B 17/561 (2013.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 1/021 (2013.01); H05K 1/18 (2013.01); G03B 17/55 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An image capture device comprising:
a housing;
a battery cage;
an integrated sensor and lens assembly;
a heatsink located partially or completely within the housing, wherein the heatsink comprises:
a cutout through which a portion of the integrated sensor and lens assembly extends;
a planar surface located adjacent to the cutout, wherein the planar surface comprises a front side and a rear side;
bosses configured to receive fasteners that connect a component to the heatsink;
a first mounting flange extending from a top of the heatsink; and
a finger mounting flange extending from a bottom of the heatsink;
a printed circuit board in communication with the rear side of the planar surface of the heatsink, wherein the printed circuit board and the battery cage are located between the first mounting flange and the finger mounting flange, and wherein the printed circuit board and the heatsink are connected together via one or more of the bosses; and
a liquid crystal display (LCD) recess located in the front side of the planar surface of the heatsink that is configured to receive a liquid crystal display (LCD), wherein the LCD recess is opposite the printed circuit board.