US 12,407,770 B2
Electronic device including cable connector
Sungwu Park, Gyeonggi-do (KR); Sangmin Lee, Gyeonggi-do (KR); and Junhee Han, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Nov. 25, 2022, as Appl. No. 17/994,058.
Application 17/994,058 is a continuation of application No. PCT/KR2022/018253, filed on Nov. 18, 2022.
Claims priority of application No. 10-2021-0159468 (KR), filed on Nov. 18, 2021.
Prior Publication US 2023/0156107 A1, May 18, 2023
Int. Cl. H04M 1/00 (2006.01); H01R 12/73 (2011.01); H04M 1/02 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2025.01); H05K 9/00 (2006.01)
CPC H04M 1/0274 (2013.01) [H01R 12/732 (2013.01); H04M 1/0277 (2013.01); H05K 1/189 (2013.01); H05K 9/0081 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic device including a plurality of electrical components, the electronic device comprising:
a first substrate including a circuit electrically connected to an electrical component from among the plurality of electrical components, wherein a through hole is formed penetrating the first substrate in a thickness direction from an upper surface of the first substrate;
a cable;
a head part coupled to an end portion of the cable;
a socket part including a contact pin of which at least a portion is disposed inside the through hole and extending with respect to a lower surface of the first substrate, the socket part being electrically connected to the first substrate, and coupled to the head part in a direction of the upper surface of the first substrate; and
a second substrate positioned on below an area of the lower surface of the first substrate in which the through hole is formed,
wherein the first substrate comprises:
a plurality of contact pads formed at the lower surface of the first substrate, and electrically connected to the circuit of the first substrate,
wherein the second substrate includes wiring coupled to at least two of the plurality of contact pads so as to interconnect the at least two of the second contact pads.