US 12,407,657 B1
In-band DSP management interface
Todd Rope, Santa Clara, CA (US); Whay Sing Lee, Santa Clara, CA (US); and Arash Farhoodfar, Santa Clara, CA (US)
Assigned to MARVELL ASIA PTE LTD, Singapore (SG)
Filed by MARVELL ASIA PTE LTD, Singapore (SG)
Filed on Mar. 27, 2023, as Appl. No. 18/190,562.
Application 18/190,562 is a continuation of application No. 16/730,770, filed on Dec. 30, 2019, granted, now 11,616,764.
This patent is subject to a terminal disclaimer.
Int. Cl. H04L 9/40 (2022.01); G06F 8/61 (2018.01); H04L 41/00 (2022.01); H04L 41/14 (2022.01); H04L 49/25 (2022.01)
CPC H04L 63/0428 (2013.01) [G06F 8/61 (2013.01); H04L 41/14 (2013.01); H04L 41/20 (2013.01); H04L 49/25 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A communication system comprising:
a module device comprising a digital signal processor (DSP) and a DSP microcontroller unit (MCU) coupled to and integrated into the DSP;
a host-side interface of the module device, the host-side interface configured to interface the DSP MCU to a host MCU of a host device; and
a line-side interface of the module device, the line-side interface configured as a high-speed in-band DSP management interface configured to interface the DSP MCU to a communication device, the DSP MCU configured to stream data via the communication device over an optical communication channel using the high-speed in-band DSP management interface while bypassing the host MCU of the host device.